JPH0316324U - - Google Patents

Info

Publication number
JPH0316324U
JPH0316324U JP7647289U JP7647289U JPH0316324U JP H0316324 U JPH0316324 U JP H0316324U JP 7647289 U JP7647289 U JP 7647289U JP 7647289 U JP7647289 U JP 7647289U JP H0316324 U JPH0316324 U JP H0316324U
Authority
JP
Japan
Prior art keywords
nozzle
gas
holes
ejection holes
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7647289U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7647289U priority Critical patent/JPH0316324U/ja
Publication of JPH0316324U publication Critical patent/JPH0316324U/ja
Pending legal-status Critical Current

Links

JP7647289U 1989-06-28 1989-06-28 Pending JPH0316324U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7647289U JPH0316324U (en]) 1989-06-28 1989-06-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7647289U JPH0316324U (en]) 1989-06-28 1989-06-28

Publications (1)

Publication Number Publication Date
JPH0316324U true JPH0316324U (en]) 1991-02-19

Family

ID=31617974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7647289U Pending JPH0316324U (en]) 1989-06-28 1989-06-28

Country Status (1)

Country Link
JP (1) JPH0316324U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017056155A1 (ja) * 2015-09-28 2017-04-06 株式会社日立国際電気 半導体装置の製造方法、基板処理装置および記録媒体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017056155A1 (ja) * 2015-09-28 2017-04-06 株式会社日立国際電気 半導体装置の製造方法、基板処理装置および記録媒体
JPWO2017056155A1 (ja) * 2015-09-28 2018-06-28 株式会社日立国際電気 半導体装置の製造方法、基板処理装置および記録媒体
US10287680B2 (en) 2015-09-28 2019-05-14 Kokusai Electric Corporation Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

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